Click to Skip Ad
Closing in...
  1. Best Amazon Finds Under $30
    08:33 Deals

    10 Amazon finds under $30 each that people are obsessed with right now

  2. Prime Day 2021 Deals
    10:22 Deals

    Amazon just revealed its official list of Prime Day 2021 best-sellers

  3. Amazon Deals
    10:37 Deals

    Today’s top deals: Free $15 Amazon credit, AirPods Pro back on sale, $39 soundbar, $…

  4. MyQ Smart Garage Door Opener
    08:37 Deals

    Oops! Prime Day’s best-selling smart home gadget is still down to $17

  5. Wireless Borescope Camera
    13:49 Deals

    Crazy wireless camera that lets your phone see anywhere is still down to $29 at Amazon




Latest iPhone 6s rumor offers detailed info on internal hardware

August 17th, 2015 at 4:55 PM
iPhone 6s Rumors A9 SiP Design

The iPhone 6s launch event is weeks away and now we’re getting some rumors on the nitty-gritty technical specifications of Apple’s newest smartphone. According to a Chinese source familiar with Apple plans, the company will use a System in Package (SiP) architecture for the motherboard of the iPhone 6s, a feat first seen in the Apple Watch. The source, whose accuracy with Apple rumors isn’t established, posted a bunch of alleged iPhone 6s schematics on Weibo and additional details about the iPhone 6s.

DON’T MISS: Leak: This is (probably) Google’s Nexus 6 successor

Apparently, the A9 chip will be 15% smaller than the A8 found in the iPhone 6 and the new iPhone 6s will still come in 16GB, 32GB and 128GB memory versions. The source further said that there’s no baseband chip on the motherboard, with the A9 chip supposedly integrating it alongside power management. Other chips are also integrated in “packages,” G for Games notes.

The most important detail in this new leak, assuming the source’s schematics are accurate, is that SiP motherboard design will replace PCB (Printed Board Circuit). Using SiPs, Apple can further simplify the internal design of the iPhone’s motherboard. This would allow Apple to either increase the battery of the device or reduce its thickness. SiP design made it possible to integrate smartphone-grade components in the Apple Watch, as these parts previously wouldn’t fit into a watch.

Other reports have also revealed that one other key Apple Watch technology – Force Touch gestures – will be available in the iPhone 6s and in the iPhone 6s Plus. The tech requires additional display hardware to register the differences between touches. By using a SiP design, the company could add Force Touch components without compromising on battery capacity or smartphone thickness.

Obviously, this is just speculation based on recent leaks, all yet to be confirmed by Apple.

The alleged iPhone 6s schematics follow below.

Chris Smith started writing about gadgets as a hobby, and before he knew it he was sharing his views on tech stuff with readers around the world. Whenever he's not writing about gadgets he miserably fails to stay away from them, although he desperately tries. But that's not necessarily a bad thing.




Popular News