The iPhone 6s launch event is weeks away and now we’re getting some rumors on the nitty-gritty technical specifications of Apple’s newest smartphone. According to a Chinese source familiar with Apple plans, the company will use a System in Package (SiP) architecture for the motherboard of the iPhone 6s, a feat first seen in the Apple Watch. The source, whose accuracy with Apple rumors isn’t established, posted a bunch of alleged iPhone 6s schematics on Weibo and additional details about the iPhone 6s.
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Apparently, the A9 chip will be 15% smaller than the A8 found in the iPhone 6 and the new iPhone 6s will still come in 16GB, 32GB and 128GB memory versions. The source further said that there’s no baseband chip on the motherboard, with the A9 chip supposedly integrating it alongside power management. Other chips are also integrated in “packages,” G for Games notes.
The most important detail in this new leak, assuming the source’s schematics are accurate, is that SiP motherboard design will replace PCB (Printed Board Circuit). Using SiPs, Apple can further simplify the internal design of the iPhone’s motherboard. This would allow Apple to either increase the battery of the device or reduce its thickness. SiP design made it possible to integrate smartphone-grade components in the Apple Watch, as these parts previously wouldn’t fit into a watch.
Other reports have also revealed that one other key Apple Watch technology – Force Touch gestures – will be available in the iPhone 6s and in the iPhone 6s Plus. The tech requires additional display hardware to register the differences between touches. By using a SiP design, the company could add Force Touch components without compromising on battery capacity or smartphone thickness.
Obviously, this is just speculation based on recent leaks, all yet to be confirmed by Apple.
The alleged iPhone 6s schematics follow below.
