After many reports claimed that Qualcomm encountered performance issues with its 2015 64-bit octa-core flagship processor, the company has once again denied that the chip has overheating issues, The Wall Street Journal reports. At the same time, sources familiar with the matter are also saying that Qualcomm is making a different Snapdragon 810 SoC for the Galaxy S6, even if there aren’t any heat issues with the current one.
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So far, LG has already defended the Snapdragon 810, also found inside the G Flex 2 smartphone announced at CES 2015. The company said it managed to work around the heat emissions for the G Flex 2, while Qualcomm is “is contending with reports that a new chip for smartphones generates too much heat,” without providing other details about it.
“Heat levels don’t depend entirely on the CPU (mobile processor) but also on how the phone’s internal cooling system is designed,” LG’s smartphone development vice president Choi Yong-su said.
The Snapdragon 810 SoC revision should be available to Samsung in March, the Journal said, although it’s not clear if that’s fast enough to meet Samsung’s Galaxy S6 launch needs. Recent reports revealed that the South Korean giant might revert to using its own chips inside the first versions of the Galaxy S6, with Qualcomm’s SoC to be used in future production runs.