Apple, Samsung and HTC are reportedly interested in releasing more power efficient smartphones that will incorporate some form of liquid cooling. According to Digitimes, all three companies may adopt “ultra-thin heat pipes” in some next-generation smartphones. The cooling modules that might be used in the phones are said to be similar to those found in laptops, which are used to carry heat away from processors and wireless chips. NEC recently released a smartphone, known as Medias X06E, that utilizes a heat pipe with a diameter of just 0.6mm, half the size of pipes used in ultrabooks. Digitimes claims that Apple, Samsung and HTC will release smartphones with liquid cooling mechanisms beginning in the fourth quarter this year at the earliest.