Apple’s next generation iPhone 6 and 5.5-inch “iPhone Air” phablet are reportedly nearing the mass production phase and as a result, we’ve seen component leaks kick into high gear recently. Monday morning we seemingly saw the main printed circuit board (PCB) from the iPhone 6 for the first time, and now a new leak may show the iPhone 6 circuit board next to the same component from the larger 5.5-inch iPhone, again supporting the notion that Apple is planning two new iPhone models this year.
FROM EARLIER: iPhone 6 and next-gen Retina iPad mini rendered by design master
French Apple news site Nowhereelse.fr on Monday published photos it obtained from an unnamed source in China that supposedly show both main circuit boards from Apple’s upcoming 2014 iPhone models. The parts from each device are similar, however the report notes that two different serial numbers — 820-3675-04 and 820-2486-09 — are visible on the components.
The leak once again supports countless rumors that Apple will launch two new iPhones this year, finally embracing the larger displays that the company has known customers want since back in 2012 when an internal presentation admitted that “consumers want what we don’t have.”
Earlier reports suggest that Apple’s main iPhone 6 will launch sometime in September — possibly on September 19th, as multiple reports have suggested — and the larger 5.5-inch iPhone phablet will then be released in October or November.
Images from this new leak, which supposedly show the iPhone 6 and iPhone Air logic boards with the similar iPhone 5s component between them, follow below.
