A new iPhone 6 internal component has been leaked, with Nowhereelse posting images that show the purported main iPhone 6 printed circuit board (PCB) as received from a reliable Chinese source. The leaked logic board does not have any of the chips you’d expect to see on it, and appears to fit the 4.7-inch iPhone 6 model. The component is similar to the iPhone 5s’ logic board, although it has a longer top section, with MacRumors noticing that screw holes in this elongated area fit screw holes from a leaked iPhone 6 back case.
FROM EARLIER: 5.5-inch iPhone 6 and new iPads reportedly heading to production in September
The Chinese source has further told Nowhereelse that the iPhone 6 will pack an NFC chip and support faster Wi-Fi ac speeds. No iPhone to date has offered NFC connectivity or Wi-Fi ac.
A recent report said that Apple will launch its own mobile payment system later this year, possibly alongside the iPhone 6 models, with NFC being one of the possible wireless choices for the company of establishing a secure connection between iPhones and payment terminals.
MacRumors has also looked at the potential placement of various logic board components based on the similarity with other iPhone board, although nothing can be confirmed at this time.
Apple is expected to launch two distinct iPhone 6 models this year, including a 4.7-inch and a 5.5-inch model.
Images showing this alleged iPhone 6 component follow below, with more pictures available at the links found at the end of the post.
