Images of what is claimed to be part of the motherboard from Apple’s next-generation iPhone 5S handset leaked on Thursday. The photos were originally published by Japan-based cell phone parts and accessories vendor Moumantai, and they show redesigned internal components that suggest earlier rumors claiming the iPhone 5S will include an upgraded rear camera may be accurate. Apple’s next iPhone is expected to launch this fall with an upgraded processor and a new camera, which may feature 12-megapixel resolution and improved low-light image capture capabilities. The photos of the purported iPhone 5S part, which features a new shape and redesigned connectors, follow below alongside comparison shots of the iPhone 5 motherboard.
New iPhone 5S parts pictured in fresh leak point to upgraded camera
Updated Dec 19th, 2018 8:41PM EST
Image: Michael Steeber
If you buy through a BGR link, we may earn an affiliate commission, helping support our expert product labs.
Zach Epstein has been the Executive Editor at BGR for more than 10 years. He manages BGR’s editorial team and ensures that best practices are adhered to. He also oversees the Ecommerce team and directs the daily flow of all content. Zach first joined BGR in 2007 as a Staff Writer covering business, technology, and entertainment.
His work has been quoted by countless top news organizations, and he was recently named one of the world's top 10 “power mobile influencers” by Forbes. Prior to BGR, Zach worked as an executive in marketing and business development with two private telcos.
