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Microsoft KIN TWO teardown reveals some surprises

May 18th, 2010 at 7:30 PM

The fine folks iFixit have once again teamed up with Chipworks to tear down one of the greatest latest gadgets to hit the scene in the KIN TWO. Before you tune out and keep on scrolling, we should let you know that a lot of impressive stuff was uncovered after cracking the thing wide open. So without further ado, here’s a summary of what was found. The brains of the phone, a NVIDIA Tegra APX2600, are sandwiched together with memory in a four die, chip-on-chip package. The 8 megapixel IMX046 image sensor from Sony takes up only .5mm3 and has a pixel size of 1.4 micrometers. Other chips include a Qualcomm QSC8065 and a Texas Instruments WL1271A that takes care of Wi-Fi, Bluetooth and the FM Radio. The digitizer is a Clearpad made by Synaptics, and the USB 2.0 transceiver is an incredibly tiny 4mm2. Pretty crazy to think that there’s so much advanced technology in a cheap featurephone, right?


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