Samsung’s next-generation Galaxy S III will reportedly be one of the thinnest smartphones in the world when it is unveiled in the coming months. South Korea’s Electronic Times News on Monday cited unnamed sources in claiming Samsung’s upcoming flagship superphone will pack impressive specs into a case that is just 7 millimeters thick; the thinnest version of Samsung’s current flagship, the Galaxy S II, features a case that is 8.49 millimeters thick. The site also states that the Galaxy S III will feature an 8-megapixel rear camera, a 2-megapixel front camera, a Super AMOLED Plus display and the Android 4.0 operating system. An earlier report claimed the Galaxy S III could launch as soon as April, but Electronic Times News claims the handset will hit store shelves in May. Recent rumors suggest Samsung’s Galaxy S III will feature a quad-core processor, a Super AMOLED Plus HD display, 4G LTE connectivity, 2GB of RAM and Android 4.0 Ice Cream Sandwich.

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Zach Epstein has worked in and around ICT for more than a decade, first in marketing and business development with two private telcos, then as a writer and editor covering business news, consumer electronics and telecommunications. Zach’s work has been quoted by countless top news publications. He was also recently named one of the world's top-10 “power mobile influencers” by Forbes, as well as one of Inc. Magazine's top-30 Internet of Things experts.