NVIDIA Tegra 3 smartphones to ship this quarter, says CEO

By on February 16, 2012 at 8:30 AM.

NVIDIA Tegra 3 smartphones to ship this quarter, says CEO

During NVIDIA’s earnings call on Wednesday, CEO Jen-Hsun Huang told investors that quad-core Tegra 3 smartphones would ship this quarter. “This quarter we are expecting to ship Tegra 3 based superphones,” Huang said. “At Mobile World Congress is when we expect to announce these devices, and we expect to announce and ship them this quarter.” The company also announced that its 3G/4G LTE system on a chip will be coming to devices sometime this year. The current generation of LTE phones and tablets use radio chips that are separate from the processor, however numerous companies are looking to integrate LTE into a single chipset. “We will have shipping modems this year, hopefully sooner than later,” Huang said. NVIDIA looks to compete with Qualcomm, which plans to soon release an integrated 4G LTE Snapdragon chipset. More →

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Nokia Windows Phones to pack dual-core processors

By on May 20, 2011 at 9:45 PM.

Nokia Windows Phones to pack dual-core processors

Nokia will launch 12 Windows Phone devices in 2012 — and a few of them will offer dual-core processors. Speaking to Forbes during STMicroelectronics’ analyst day, STMicroelectronics’ CEO Carlo Bozotti confirmed that his company still has “very close relations” with Nokia and that it will be “an important supplier” in Nokia’s future Windows Phone products. A few of Nokia’s phones will be powered by ST-Ericsson’s U8500 system-on-a-chip (SoC) package, which offers support ARM Cortex-A9 dual-core processors. Nokia is said to already have a Windows Phone in the works, and while the company has set a 2012 target date for its debut, Nokia’s CEO Stephen Elop has expressed interest in shipping it before the end of 2011. More →

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Texas Instrument pushing for a more engaging ‘smart device’ experience

By on February 14, 2011 at 4:23 PM.

Texas Instrument pushing for a more engaging ‘smart device’ experience

Today at Mobile World Congress, mobile processor juggernaut Texas Instrument held a press event to offer some additional details about its OMAP 4 and 5 processor lines. Greg Delagi, the company’s senior vice president and general manager, gave the keynote — which took place right on the showroom floor. He emphatically talked about the need to push the capabilities of “smart devices” forward while being mindful of the constraints battery technology puts on the industry. Both RIM and LG were brought on stage — the PlayBook and Optimus 3D both use the OMAP 4 platform — and they too heralded the headway TI is making with its system on a chip (SoC) OMAP processors. The company even has technology in place that will bring cost effective, power efficient gesture recognition and Pico DLP technology to a wider array of smartphones and smart devices; it works just like the Kinect. We have some video of the motion-based gesture recognition, in action running on prototype hardware after the break, along with some of Mr. Delagi’s thoughts on why OMAP is such an effective mobile processor. More →

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Broadcom gets Bluetooth 4.0 certification

By on July 14, 2010 at 8:58 AM.

Broadcom gets Bluetooth 4.0 certification

Broadcom Logo

Today, Broadcom announced that it has gained Bluetooth 4.0 certification for its BTE Bluetooth stack and system-on-a-chip solutions. The new Bluetooth 4.0 standard has lower overhead than previous iterations of the technology, using less power and having a lower cost, while providing better range. Expect to see Bluetooth 4.0 hitting mobile devices in early 2012. We’ve got the official press release ready for you after the bounce. More →

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Samsung looks to make wireless phones more… wireless

By on February 12, 2009 at 7:42 AM.

Samsung looks to make wireless phones more… wireless

Somewhere over the rainbow in a land far away, wireless phones will actually be wireless. We’re not just talking about cellular voice and data here of course, we’re talking about handsets that can communicate, move data, sync and be charged all without the need for a single external wired connection. We still have a ways to go before technologies such as inductive charging and higher-speed data transfer standards are a commonplace, but Samsung has just announced a major step towards that reality with the advent of Wireless USB. By way of new System-on-a-Chip (SoC) technology, Samsung claims W-USB will allow portable devices such as mobile handsets and digital cameras to connect wirelessly using an interface that is nearly identical to a wired USB connection. Dr. Yiwan Wong, vice president, System LSI Division at Samsung is heading up the group responsible for the breakthrough and had this to say:

Connected consumer electronic products are the next step in enabling anytime, anywhere access to information and services. One of the keys to wireless connectivity is W-USB technology. While W-USB technology is just beginning to ramp up, its application will soon increase with the consumer electronic and mobile phone markets’ demand for wireless connectivity technology and UWB’s fast download speeds.

The SoC itself is comprised of a built-in ARM core, a UWB physical layer, a memory controller and a memory component. It operates in the 3.1~10.6 GHz-band range and as far as numbers go, we’re looking at speeds of 480 Mbps. Real world tests have shown actual transfer speeds of 120 Mbps which is hardly a rate to be scoffed at and security hounds will be happy to know Samsung employs 128 bit AES encryption to thwart prowlers. Long story short, W-USB can’t happen soon enough.

[Via DailyTech]

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