Sony unveils new ultra thin back-illuminated CMOS image sensor
Sony unveils new ultra thin back-illuminated CMOS image sensor
Sony on Monday announced its latest and thinnest back-illuminated CMOS image sensor that will no doubt help manufacturers create thinner smartphones. “Sony has succeeded in establishing a structure that layers the pixel section containing formations of back-illuminated structure pixels over the chip affixed with mounted circuits for signal processing, which is in place of supporting substrates used for conventional back-illuminated CMOS image sensors,” Sony explained in its announcement. “By this stacked structure, large-scale circuits can now be mounted keeping small chip size.” The chip’s features include:
- Large-scale signal processing circuits required for higher image quality and better functionality are built-in
- More compact image sensor chip size
- Even higher image quality of the pixel section by adopting manufacturing processes specialized for superior image quality
- Faster speeds and lower power consumption by adopting the leading process for the circuit section
Sony will begin shipping samples to manufacturers in March. The company’s full press release follows after the break. More →



