Another major iPhone 6 component revealed in new leak

iPhone 6 Components LeakImage Source: Mustafa Dagdelen

Ho-hum: Another day, another major iPhone 6 component leak. Nowhereelse.fr has snagged a new picture that for the first time shows us the iPhone 6’s motherboard. Nowhereelse.fr notices that you can’t see the iPhone 6’s A8 processor in this particular picture of the motherboard although MacRumors has done a nice job of showing us exactly where the chip should be on the motherboard using the same leaked photo.

FROM EARLIER: Never-before-seen iPhone 6 components appear in another huge leak

“While several physical features such as the nano-SIM slot, a number of connectors for flex cable components, and a flash storage chip that appears to be from Toshiba are visible in the somewhat blurry photo, the most interesting components of the board unfortunately remain hidden under electromagnetic shielding,” writes MacRumors, which goes on to also point out the locations of the flash storage chip, SIM slot and Wi-Fi module on the leaked component.

We’ve seen a ton of different iPhone 6 parts leak over the last week, including the device’s translucent Apple logo and camera lens. At this point there really won’t be any surprise when Apple finally does unveil the new device on September 9th.

To get more in-depth analysis of this latest leaked part, be sure to click both source links below for MacRumors and Nowhereelse.fr’s respective takes. The picture of the leaked iPhone 6 motherboard is posted below.

Carte-Mere-iPhone6

blog comments powered by Disqus